Scienscope X-RAY 3D AXI 8000 Fully Automatic
Product Overview
The Scienscope X-RAY 3D AXI 8000 Fully Automatic is an entirely automated 3D X-ray inspection system that utilizes sophisticated CT (Computed Tomography) technology. This advanced scanner provides a complete 360-degree view within your electronic components without requiring disassembly.
How It Works
The system captures projection mappings by rotating around the object in a full circle, then employs edge-scan and 3D analysis techniques to reconstruct all collected data. This creates a digital 3D replica that allows examination of internal structures from any perspective to identify even the tiniest defects.
What is 3D AXI?
3D Automated X-ray Inspection (AXI) represents a cutting-edge approach in electronics manufacturing, designed to deliver comprehensive evaluations of Printed Circuit Boards (PCBs). Unlike conventional 2D X-ray methods, 3D AXI leverages computed tomography (CT) to produce detailed, three-dimensional visualizations of the internal composition of electronic components and solder connections. This sophisticated technique identifies defects undetectable via 2D X-ray, including voids, misalignments, and inadequate solder application.
Technical Specifications
| Parameter Category |
Specification |
Details |
| X Illuminant |
Light tube voltage, current |
130KV 300uA |
| Maximum Output |
|
39W |
| FPD |
Resolution ratio |
50um |
| Frame Rate |
|
1x1 9fps, 2x2 18fps |
| Pixel Size |
|
2340x2882 |
| CCD Camera |
Pixel |
2.3 megapixel |
| Function |
|
Scan the barcode |
| CT Parameters |
Resolution ratio |
5um |
| Number of Projections |
|
32,64,120 |
| Shooting Angle |
|
60°, 90° |
| Maximum Number of Layers |
|
Unlimited (recommended <300) |
| Test Parameters |
Feed height |
85mm on top, 20mm on bottom |
| Delivery Direction |
|
Left in, right out |
| PCB Size |
|
100x50-400x400 |
| Circuit Board Thickness |
|
≥0.5mm |
| Height of Test Object Components |
|
85mm on top, 20mm on bottom |
| Object Weight |
|
≤5KG |
| FOV Size |
|
58x70mm (25μm precision), 11x14mm (5μm precision) |
| Plate Bending Correction |
|
Hardware correction |
| Safety |
Radiation |
1μSv/H |
| Safety Interlocking |
|
Available |
| Environmental Requirements |
Working Temperature |
0-40℃ |
| Working Humidity |
|
40%-60% |
| Working Power Supply |
|
220V |
| Aggregate Capacity |
|
2KW |
| Pressure Requirements |
|
0.4-0.6 MPa |
| Load Capacity Requirements |
|
1.5T/㎡ |
| Device Appearance |
Size |
1625mm*1465mm*1905mm |
| Weight |
|
2.5T |
Key Advantages
- Extensive Flaw Detection: Identifies a broad spectrum of defects including solder joint integrity issues, component displacement, air pockets, and concealed electrical short circuits.
- High-Resolution Imaging: Employs advanced X-ray cameras and sophisticated algorithms to secure detailed imagery for critical insights into PCB internal architecture and robustness.
- Streamlined Efficiency and Usability: Equipped with intuitive interfaces and user-friendly software for straightforward operation and rapid inspection cycles to boost production throughput.
- Automated Calibration: Features automatic adjustment of inspection parameters to accommodate production changes, minimizing setup losses and manual recalibrations.
Essential Attributes & Specifications
- Complete 3D X-Ray Analysis: Offers full 3D reconstruction for thorough assessment.
- Non-Invasive Assessment: Allows inspection of circuit boards without inducing damage.
- Adaptable Layer Selection: Permits selection of necessary layers for examination.
- Customizable Resolution: Enables adjustment of resolution based on component dimensions and solder balls, ensuring precision.
- Accelerated Edge Scanning: Incorporates rapid scanning and reconstruction technologies.
- Broad Ray Cone Angle: Delivers superior longitudinal resolution for enhanced inspection.
Common Applications
- Inspection of Surface Mount Technology (SMT) and Through-Hole Components: Guarantees quality of solder joints and precision of component placement in both SMT and through-hole assemblies.
- Examination of Ball Grid Arrays (BGAs) and Press-Fit Connectors: Detects faults in BGA solder joints and verifies integrity of press-fit connections.
- Dual-Sided PCB Analysis: Evaluates both faces of double-sided PCBs to ensure uniform quality standards.
Cutting-Edge Technologies
- Computed Tomography (CT): Utilizes X-rays to create sectional images compiled into 3D representations.
- High-Definition X-Ray Cameras: Capture intricate images of internal structures of electronic parts.
- Automated Anomaly Recognition (AAR): Employs software algorithms to automatically identify defects through image analysis.
- Real-Time Oversight and Management: Empowers operators to supervise inspection processes and implement adjustments as required.
Merits of Adopting 3D AXI
- Enhanced Quality Assurance: Identifies defects early in production, preventing circulation of defective products.
- Amplified Productivity: Automates inspection workflow, reducing manual labor and accelerating production speeds.
- Economical Benefits: Lowers waste and rework needs by spotting defects before they escalate.
- Heightened Dependability: Confirms electronic goods adhere to highest quality and reliability benchmarks.
Conclusion
Scienscope X-RAY AXI 8000 3D AXI systems are indispensable for upholding the quality and dependability of electronic products. By supplying comprehensive three-dimensional imagery of internal structures, these systems enable manufacturers to uncover defects that might otherwise go unnoticed.
Packaging and Delivery Information
- Delivery: 5-8 business days (varies based on order quantity)
- Minimum Order: Single machine or mixed orders accepted
- Transportation: Bulk shipping or container shipment based on order size
- Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
- Price: Negotiable for best value
- Packaging: Standard export boxes or robust hardwood packages for safe delivery