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Shenzhen CN Technology Co. Ltd.. 86-135-3787-5415 Lizzy@smtlinemachine.com
Scienscope X-RAY 3D AXI 8000 Fully Automatic

Scienscope X-RAY 3D AXI 8000 Fully Automatic

  • Highlight

    Scienscope X-RAY 3D AXI 8000 machine

    ,

    fully automatic SMT line machine

    ,

    3D AXI X-RAY inspection system

  • Brand Name
    Scienscope
  • Model Number
    X-RAY 3D AXI 8000 Fully Automatic
  • Minimum Order Quantity
    1 set of machine or mixed order is also acceptable
  • Price
    Negotiable
  • Packaging Details
    Standard export boxes and sturdy hardwood packages are both options
  • Delivery Time
    5-8 Working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union,MoneyGram

Scienscope X-RAY 3D AXI 8000 Fully Automatic

Scienscope X-RAY 3D AXI 8000 Fully Automatic
Product Overview

The Scienscope X-RAY 3D AXI 8000 Fully Automatic is an entirely automated 3D X-ray inspection system that utilizes sophisticated CT (Computed Tomography) technology. This advanced scanner provides a complete 360-degree view within your electronic components without requiring disassembly.

How It Works

The system captures projection mappings by rotating around the object in a full circle, then employs edge-scan and 3D analysis techniques to reconstruct all collected data. This creates a digital 3D replica that allows examination of internal structures from any perspective to identify even the tiniest defects.

What is 3D AXI?

3D Automated X-ray Inspection (AXI) represents a cutting-edge approach in electronics manufacturing, designed to deliver comprehensive evaluations of Printed Circuit Boards (PCBs). Unlike conventional 2D X-ray methods, 3D AXI leverages computed tomography (CT) to produce detailed, three-dimensional visualizations of the internal composition of electronic components and solder connections. This sophisticated technique identifies defects undetectable via 2D X-ray, including voids, misalignments, and inadequate solder application.

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Technical Specifications
Parameter Category Specification Details
X Illuminant Light tube voltage, current 130KV 300uA
Maximum Output 39W
FPD Resolution ratio 50um
Frame Rate 1x1 9fps, 2x2 18fps
Pixel Size 2340x2882
CCD Camera Pixel 2.3 megapixel
Function Scan the barcode
CT Parameters Resolution ratio 5um
Number of Projections 32,64,120
Shooting Angle 60°, 90°
Maximum Number of Layers Unlimited (recommended <300)
Test Parameters Feed height 85mm on top, 20mm on bottom
Delivery Direction Left in, right out
PCB Size 100x50-400x400
Circuit Board Thickness ≥0.5mm
Height of Test Object Components 85mm on top, 20mm on bottom
Object Weight ≤5KG
FOV Size 58x70mm (25μm precision), 11x14mm (5μm precision)
Plate Bending Correction Hardware correction
Safety Radiation 1μSv/H
Safety Interlocking Available
Environmental Requirements Working Temperature 0-40℃
Working Humidity 40%-60%
Working Power Supply 220V
Aggregate Capacity 2KW
Pressure Requirements 0.4-0.6 MPa
Load Capacity Requirements 1.5T/㎡
Device Appearance Size 1625mm*1465mm*1905mm
Weight 2.5T
Key Advantages
  • Extensive Flaw Detection: Identifies a broad spectrum of defects including solder joint integrity issues, component displacement, air pockets, and concealed electrical short circuits.
  • High-Resolution Imaging: Employs advanced X-ray cameras and sophisticated algorithms to secure detailed imagery for critical insights into PCB internal architecture and robustness.
  • Streamlined Efficiency and Usability: Equipped with intuitive interfaces and user-friendly software for straightforward operation and rapid inspection cycles to boost production throughput.
  • Automated Calibration: Features automatic adjustment of inspection parameters to accommodate production changes, minimizing setup losses and manual recalibrations.
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Essential Attributes & Specifications
  • Complete 3D X-Ray Analysis: Offers full 3D reconstruction for thorough assessment.
  • Non-Invasive Assessment: Allows inspection of circuit boards without inducing damage.
  • Adaptable Layer Selection: Permits selection of necessary layers for examination.
  • Customizable Resolution: Enables adjustment of resolution based on component dimensions and solder balls, ensuring precision.
  • Accelerated Edge Scanning: Incorporates rapid scanning and reconstruction technologies.
  • Broad Ray Cone Angle: Delivers superior longitudinal resolution for enhanced inspection.
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Common Applications
  • Inspection of Surface Mount Technology (SMT) and Through-Hole Components: Guarantees quality of solder joints and precision of component placement in both SMT and through-hole assemblies.
  • Examination of Ball Grid Arrays (BGAs) and Press-Fit Connectors: Detects faults in BGA solder joints and verifies integrity of press-fit connections.
  • Dual-Sided PCB Analysis: Evaluates both faces of double-sided PCBs to ensure uniform quality standards.
Cutting-Edge Technologies
  • Computed Tomography (CT): Utilizes X-rays to create sectional images compiled into 3D representations.
  • High-Definition X-Ray Cameras: Capture intricate images of internal structures of electronic parts.
  • Automated Anomaly Recognition (AAR): Employs software algorithms to automatically identify defects through image analysis.
  • Real-Time Oversight and Management: Empowers operators to supervise inspection processes and implement adjustments as required.
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Merits of Adopting 3D AXI
  • Enhanced Quality Assurance: Identifies defects early in production, preventing circulation of defective products.
  • Amplified Productivity: Automates inspection workflow, reducing manual labor and accelerating production speeds.
  • Economical Benefits: Lowers waste and rework needs by spotting defects before they escalate.
  • Heightened Dependability: Confirms electronic goods adhere to highest quality and reliability benchmarks.
Conclusion

Scienscope X-RAY AXI 8000 3D AXI systems are indispensable for upholding the quality and dependability of electronic products. By supplying comprehensive three-dimensional imagery of internal structures, these systems enable manufacturers to uncover defects that might otherwise go unnoticed.

Contact Information

For inquiries, please contact us at:

Phone: +8613537875415
Email: Lizzy@smtlinemachine.com
Address: Xintian Industrial Area, Baoan, Shenzhen City, China

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Packaging and Delivery Information
  • Delivery: 5-8 business days (varies based on order quantity)
  • Minimum Order: Single machine or mixed orders accepted
  • Transportation: Bulk shipping or container shipment based on order size
  • Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Price: Negotiable for best value
  • Packaging: Standard export boxes or robust hardwood packages for safe delivery