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SMT Line Machine
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SMT Pick And Place Machine
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SMT Stencil Printer
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SMT Reflow Oven
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SMT Periphery Equipment
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SMT Feeder
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YAMAHA FEEDER
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SAMSUNG FEEDER
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JUKI FEEDER
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PANASONIC FEEDER
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SMT Nozzle
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SMT Spare Parts
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SMT Machine Parts
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YAMAHA Spare Parts
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Samsung Spare Parts
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Panasonic Spare Parts
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JUKI Spare Parts
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AI Spare Parts
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ALEXEasy to talk with, very professional and fast service, the flag quality is super good. Even better than we ordered from Germany!!
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KrishnaI want to say that your products very good. Thank you for all your suggestion, also good after sales service.
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AlenI am Alen,we are old customer of CNSMT,nice supplier and nice friends,very good quality feeders nozzles and machines
CNSMT PCB X-Ray SMT Line Machine SMD PCBA X Ray inspection machine for LED Assembly Line
Brand | CNSMT | MODEL | PCB X RAY |
---|---|---|---|
Weight | 700KG | Lead Time | IN Stork |
Packing | BOX | CONdition | Working |
POWER | 110V/220 | PAYMENT TERM | T/T, Paypal, Westernunion Are All Allowed |
High Light | smt assembly machine,smt aoi machines |
CNSMT PCB X-Ray SMT Line Machine SMD PCBA X Ray inspection machine for LED Assembly Line
Quick Detail
The X-ray detector USES low energy x-rays to quickly detect objects without damaging them.
X-ray penetration generated by high-voltage impact on the target material is used to detect the quality of electronic components, the internal structure of semiconductor packaging products, and the welding quality of SMT welding points of all types [1].
Feature
Product Name: | X RAY |
Used for: | smt assembly full line |
Warranty: | 1 Year |
Shipment | by air |
Delivery Time: | 1-2Days |
Our Main Market | Whole of the world |
Test items:
1. Packaging technology detection of integrated circuits: layer stripping, cracking, cavitation and wiring process;
2. PCB manufacturing process detection: welding line deviation, bridging, and opening;
3. Weldability detection of surface mount process: detection and measurement of soldering point cavity;
4. Connection line inspection: open circuit, short circuit, abnormal or defective connection defects;
5. Integrity test of tin balls in tin ball array packaging and overlaying chip packaging;
6. High density plastic material cracking or metal material inspection;
7. Measurement of chip size, measurement of wire arc, measurement of tin area proportion of components.