SMT Online and Offline AOI SPI PCB solder paste test machine from cnsmt
Attachment 1:Specification
Attachment 2: On-line 3D Color SPI Advantage:
1. PMP based on white light,height resolution is 0.3um
2. Digital High Speed CCD 5M Pix,with large FOV,support high speed inspection
3. Dual 3D Projection (Single optional) avoid shadow and reflection
4. High accuracy and repeatability
5. Auto warp detect
6. 2 Marks/Board or 2 Marks/Array
7. Solder paste or red gum detection
8. 2D/3D true color image
9. Gerber 274D/X,CAD,Offline program,Bare Board Teach
10. Powerful SPC
Attachment 2: On-line 3D Color SPI Advantage:
1. PMP based on white light,height resolution is 0.3um
2. Digital High Speed CCD 5M Pix,with large FOV,support high speed inspection
3. Dual 3D Projection (Single optional) avoid shadow and reflection
4. High accuracy and repeatability
5. Auto warp detect
6. 2 Marks/Board or 2 Marks/Array
7. Solder paste or red gum detection
8. 2D/3D true color image
9. Gerber 274D/X,CAD,Offline program,Bare Board Teach
10. Powerful SPC
Attachment 2: On-line 3D Color SPI Advantage:
1. PMP based on white light,height resolution is 0.3um
2. Digital High Speed CCD 5M Pix,with large FOV,support high speed inspection
3. Dual 3D Projection (Single optional) avoid shadow and reflection
4. High accuracy and repeatability
5. Auto warp detect
6. 2 Marks/Board or 2 Marks/Array
7. Solder paste or red gum detection
8. 2D/3D true color image
9. Gerber 274D/X,CAD,Offline program,Bare Board Teach
10. Powerful SPC
| Types | Items | Specifications | ||
|
Inspection |
Camera | Digital High Speed CCD 5M Pix | ||
| Light | Ring R/G/B LED and White LED | |||
| FOV | 32mm*32mm(20μm) | |||
| Speed Per FOV | <0.6s | |||
| Detect | Solder/Red gum: Volume,Area,Height,Shape,Shift,Bridge,Overflow | |||
| Defect | None.Shift.More.Less.Bridge.Pull.Shape.Gold finger.Height.Overflow | |||
| Height Range | 10~400um | |||
| Area Range | 0.15mm×0.15mm~10mm×10mm | |||
| Height Accuracy on a Certificated Target | 1μm | |||
| Height/Area/Volume Repeatability on a Certificated Target | <1μm 3sigma | |||
| GR&R | <10% | |||
| Software | OS | Windows 7 | ||
| Vision | Spec. | Dual 3D Projection(Single optional)avoid shadow and reflection | ||
| UI | GUI/Easy use,support English/Chinese/Big5 | |||
| Result | 2D/3D true color | |||
| MARK | 2 Marks/Board or 2 Marks/Array, support bad mark | |||
| Program | Gerber 274D/X CAD,Offline program,Bare Board Teach | |||
| SPC | Offline SPC | Support | ||
| Chart | Any Time Chart | |||
| Histogram/Control/Compare chart | Volume,Area,Height,Shift | |||
| Export | Excel,Jpg,Bmp | |||
| Hardware | PCB Transmit System | Bottom-up fix; Auto transmit and width correct based on SMEMA;Height: 900±20mm | ||
| PCB Size | 50mmx50mm 330mmx250mm | |||
| PCB Thickness | 0.3mm~3mm | |||
| Max PCB Warp | <2mm | |||
| X,Y Platform | Motion | Servo Motor Control | ||
| Position Accuracy | <1μm | |||
| Speed | 700mm/s | |||
| Control system | Computer | Industrial computer:Intel 4 core/8G DDR/500G HD | ||
| Display Output | 19 inch LCD | |||
| Others | Machine Dimensions | 100cmx100cmx155cm | ||
| Weight | About 600 KG | |||
| Power Supply | AC220V±10%,50/60Hz,1200W | |||
| Working Environment | Temperature: 10-40℃,Humidity: 30-80%RH | |||
Attachment 2: On-line 3D Color SPI Advantage:
1. PMP based on white light,height resolution is 0.3um
2. Digital High Speed CCD 5M Pix,with large FOV,support high speed inspection
3. Dual 3D Projection (Single optional) avoid shadow and reflection
4. High accuracy and repeatability
5. Auto warp detect
6. 2 Marks/Board or 2 Marks/Array
7. Solder paste or red gum detection
8. 2D/3D true color image
9. Gerber 274D/X,CAD,Offline program,Bare Board Teach
10. Powerful SPC
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