HCH type fully automatic Nitrogen purification equipme

The HCH type fully automatic nitrogen purification equipment utilizes advanced adsorption technology to remove oxygen, water, and impurities from nitrogen gas. Starting with 99.9% purity nitrogen as raw material, the system employs carbon and specialized catalysts to achieve superior purification results.

The HCH type nitrogen purification equipment employs a sophisticated combination of hydrogenation catalytic deoxygenation and molecular sieve deep drying processes, specifically engineered for SMT reflow soldering applications. Ordinary nitrogen enters the system and is precisely mixed with trace amounts of hydrogen before being directed to the catalytic reaction tower. Under the influence of specialized catalysts, residual oxygen in the nitrogen reacts with hydrogen to form water, effectively completing the deoxygenation process.

Following deoxygenation, the gas undergoes initial condensation to remove water content and then proceeds to the molecular sieve drying system for deep removal of residual water vapor and minor impurities. The molecular sieve features an automatic regeneration system capable of continuous cyclic operation, ensuring 24-hour uninterrupted equipment performance.

After completing the comprehensive purification process, the system produces high-purity, low dew point nitrogen gas. All output parameters meet the stringent requirements for SMT reflow soldering oxygen-free applications, effectively preventing PCB pad oxidation and ensuring superior soldering quality.

The HCH type nitrogen purification equipment represents a high-end gas purification solution developed specifically for the electronic precision welding industry. As a mainstream SMT-specific nitrogen purifier, it serves as the core supporting equipment for reflow soldering systems, perfectly adapting to various lead-free reflow soldering production lines. This system effectively addresses common issues of insufficient gas supply purity and excessive water and oxygen content in standard nitrogen generators, providing stable high-purity protective nitrogen for SMT manufacturing processes.

This SMT reflow soldering nitrogen purification equipment utilizes mature catalytic deoxygenation and molecular sieve deep drying purification technologies. Using industrial-grade common nitrogen as raw material, the system removes residual oxygen through efficient catalytic reactions, followed by multi-stage adsorption drying treatment to deeply eliminate water vapor, impurities, and trace gas contaminants. The HCH type equipment consistently produces high-purity nitrogen with purity levels ≥ 99.999%, featuring extremely low oxygen content and dew points reaching -70°C. This performance completely eliminates common soldering issues including PCB oxidation, virtual soldering, blackening, and color variations, significantly improving surface mount soldering yield rates.

The HCH type nitrogen purification equipment features an integrated design with compact structure, minimal footprint, and straightforward installation, making it suitable for various factory workshop configurations. Equipped with a fully automatic intelligent control system, the equipment achieves automatic nitrogen-hydrogen ratio adjustment, automatic regeneration, and real-time operational monitoring. Supporting 24-hour continuous stable gas supply without requiring manual supervision, the system is ideally suited for high-intensity continuous production environments typical of SMT assembly lines.

Compared to traditional purification equipment, the HCH system offers extended catalyst service life, stable purification performance, low energy consumption, simple operation and maintenance procedures, and minimal failure rates. These advantages effectively reduce both gas and equipment maintenance costs for enterprises. With exceptional purification efficiency and reliable operational performance, this equipment finds widespread application in SMT surface mount processing, precision electronic soldering, semiconductor packaging, and related fields, serving as core supporting equipment for enhancing reflow soldering process quality and efficiency while stabilizing production output.