99.999% High-purity Nitrogen Generator For SMT Reflow Oven

Advanced nitrogen generation system specifically designed for SMT reflow oven applications, delivering ultra-high purity nitrogen for superior soldering performance.

Reflow Soldering (Most Critical)
Purpose: Nitrogen-filled furnace with oxygen content controlled at 50-1000 ppm (commonly <100 ppm).
Effect: Produces bright, full solder joints with strong wettability; reduces cold solder joints, bridging, and solder balls, increasing yield by 10-30%; suitable for BGA/QFN/0201/01005 micro-components and lead-free solder.
Purity: Conventional 99.99%; automotive/medical/aerospace require 99.999% (O₂ <10 ppm).

Wave Soldering / Selective Wave Soldering
Purpose: Nitrogen cover layer above solder pot to suppress high-temperature oxidation.
Effect: Reduces solder dross by 50-80%, lowering solder costs; creates more reliable solder joints.

Dispensing / Coating / Curing
Purpose: Nitrogen purging protection to prevent oxidation and moisture absorption of glue/coatings.
Effect: Ensures uniform coatings, strong adhesion, and stable curing, enhancing insulation and reliability.

Precision Packaging (MiniLED / Chips)
Purpose: Micro solder joint protection for BGA/QFN/CSP/SiP.
Effect: Protects extremely fine-pitch solder joints, preventing oxidation and cold solder joints.

Component / PCB Storage and Transport
Purpose: Nitrogen filling to prevent moisture and oxidation, especially for copper surfaces, gold surfaces, and precision components.
Effect: Extends shelf life and prevents solder pad oxidation.

Semiconductors: Wafer cleaning, etching, deposition, annealing, sintering, packaging protection.
Lithium Batteries: Electrode drying, nitrogen protection, explosion prevention, inert environment.
Photovoltaics: Silicon wafer cutting, diffusion, PECVD nitrogen protection.
Hardware / Precision Parts: Soldering, heat treatment, anti-oxidation protection.

Purity: 99.9%-99.999% (oxygen content 10-1000 ppm)
Dew Point: ≤ -40℃ (prevents water vapor affecting soldering)
Pressure: 0.4-0.6 MPa
Flow: Single-track 8 temperature zones 20-30 Nm³/h; dual-track 12 temperature zones 50-60 Nm³/h

Compared with liquid nitrogen / cylinders: reduces cost by 30-50%, ready to use, no supply interruption risk.
Stability: Purity / pressure / dew point controllable, suitable for 24-hour continuous production.
Cleanliness: Multi-stage filtration, oil-free and water-free, supports wash-free process.

Principle: At room temperature, oxygen is adsorbed using carbon molecular sieve (CMS) under pressure, then desorbed under reduced pressure; two towers alternate for continuous gas production.
Purity: 95%-99.9995% (commonly 99.99%/99.999% for SMT)
Flow rate: 5-5000 Nm³/h (SMT single track 20-30 Nm³/h, double track 50-60 Nm³/h)
Advantages: Fast start (3-10 minutes), adjustable purity, low energy consumption, compact size, easy maintenance
Disadvantages: Cost rises for ultra-high purity (>99.999%)
Applications: SMT reflow / wave soldering, electronic packaging, semiconductors, lithium batteries, photovoltaics.

Principle: Compressed air passes through hollow fiber membrane; O₂/CO₂/H₂O permeate quickly, while N₂ is retained and enriched.
Purity: 90%-99% (maximum ≤99%, does not meet high-purity SMT requirements)
Flow Rate: 1-1000 Nm³/h
Advantages: Ready to use immediately, smallest size, maintenance-free, no moving parts
Disadvantages: Low purity, high oxygen content, non-adjustable
Applications: Low-purity scenarios; not suitable for SMT soldering.

Principle: Air compression and purification → liquefaction (-196°C) → fractional distillation to separate N₂/O₂.
Purity: 99.999%-99.9999% (ultra-high purity)
Flow rate: 1,000 to tens of thousands Nm³/h (ultra-large flow)
Advantages: Highest purity, largest flow, can produce liquid nitrogen
Disadvantages: High investment, large footprint, slow start-up (≥24h), high energy consumption
Applications: Large-scale petrochemical, metallurgy, aerospace; rarely used in SMT.

Preferred: PSA nitrogen generator (purity 99.99%/99.999%, flow matched, low cost, easy maintenance)
Not recommended: Membrane separation (insufficient purity)
Not recommended: Cryogenic (high investment/energy consumption)

1. What nitrogen purity is required for SMT production?
General soldering: 99.99%; Automotive, medical and high-precision packaging: 99.999%.

2. Why does soldering need nitrogen protection?
Inhibits high-temperature oxidation, reduces solder dross and defective joints, improves soldering quality and product yield.

3. What is the standard dew point index?
Stably controlled below -40℃ to avoid moisture affecting welding effect.

4. Normal working pressure range?
0.4-0.6 MPa, matching daily SMT production demands.

5. How much gas consumption per hour?
20-30 Nm³/h for single-track 8-zone furnace; 50-60 Nm³/h for dual-track 12-zone furnace.

6. On-site generator vs liquid nitrogen cylinder?
On-site equipment cuts cost by 30%-50%, steady gas supply with no outage risk.

7. Can the machine run 24 hours continuously?
Yes, stable performance supports non-stop long-term operation.

8. Is the output gas clean enough?
Multi-stage filtration achieves oil-free and water-free gas, fit for no-clean welding process.

9. Common abnormal oxygen content rise?
Check air intake filter, replace aging adsorbent and inspect pipeline air leakage.

10. Daily maintenance tips?
Regularly drain water, replace filter elements periodically and keep ventilation dry.