JUKI FX-3 FX-3RAL Pick And Place Surface Mount Technology Machine , 90000cph Smt Pick Place Machine

SMT JUKI FX-3 FX-3RAL pick and place machine 90000cph WITH tray ELECTRIC FEEDER

DESCRIPTION:

A second-hand JUKI high-speed modular placement machine FX-3 is sold at a low price, with extremely high precision and in a very good condition.
JUKI high-speed modular mounter, next-generation FX high-speed, high-precision, high-reliability modular mounter
Chip components 90,000 CPH (0.040 seconds/chip, excellent condition) 66,000 CPH: chips (according to IPC9850 standard)
■ 0402 chip to 33.5mm square element
■ Laser Recognition: ±0.05mm(±3σ)
■ Laser head mounted on-the-fly flight recognition
■ Structure of 2 tables/4 shafts/4 heads/24 nozzles
■ XY axis servo motor and full closed loop control
■ More than 240 components can be loaded
■ Electric/Mechanical Replacement Trolley
2 tables, 4 axes, 4 heads
? Left and right double table and alternate pick-and-place 4 head design, optimized by 0.040 seconds / chip 90,000 (point / hour), IPC9850: 66,000 (dot / hour) high-speed placement.
New linear servo motor and full closed loop control
FX-3RA uses a new linear servo motor to control the XY axis. Through the use of optical fiber transmission servo control signal, the signal transmission is more rapid and more stable, and full closed-loop control is performed by a linear magnetic ruler with a resolution accuracy of up to 0.001 mm. While achieving high-stability and high-speed placement, it also ensures long-term operation reliability and placement accuracy.
New Laser Sensor: LNC60
The newly developed LNC60 laser sensor can complete the simultaneous suction and uniform recognition of six nozzles. Compared with the previous four-spot nozzle mounters, the chip recognition speed has increased by 20%. The LNC60's new recognition process extends the range of laser-recognized components from 0.4x0.2mm to 33.5mm square components. From tiny, ultra-thin chip components to small QFP, CSP, BGA, and other components can be identified by the laser, enabling high-speed, high-precision mounting.

Specification/Type Name High Speed ​​Modular Mounter
FX-3RAL High Speed ​​Modular Mounter
FX-3RAXL
Substrate size L substrate (410×360mm) ○ -
For L-wide substrates (510×360mm)*1 ○ -
For XL substrate (610×560mm) - ○
Long Board*1 800×360mm 800×560mm
Component height 6mm specifications ○
Component Size Laser Recognition 0402 (Inch 01005)～□33.5mm
Component placement speed
(Chip device) Excellent condition 0.040 seconds/chip (90,000CPH)*2
IPC9850 66,000CPH*2
Component Mounting Accuracy Laser Recognition ±0.05mm(±3σ)
Component placement type 240 types
(Converted to 8mm belt (when using electric double track belt feeder))
*1L-wide board and long board are optional.
*2 Except when the substrate size is XL.