Aleader ALD625 SMT offline AOI Machines Multiple MARK detection with Bad Mark function
Modular hardware and software design, use more flexible and convenient.
Embedded multiple algorithms, high detection rate, low false positive rate.
Intelligent high-speed digital camera, detection speed meets the needs of two high-speed patch lines.
The hardware structure is compatible, and parameters are automatically set for different processes. One machine is used for multiple purposes.
Automated and manual programming capabilities of automatic frame and CAD data search component libraries.
Smart digital cameras automatically read Barcode, corresponding to each piece of data.
Multi-program and double-sided detection technology automatically switch the new MODE detection program.
Multiple MARK detection with Bad Mark function.
SPC and AOI combined, timely feedback information and technology are poor.
Multi-field detection design, with a variety of applications such as after the peak, red plastic sheet, color ring resistance, component surface detection.
|Product Name:||SMT AOI OFFline Machines|
|Used for:||smt assembly full line|
|Our Main Market||Whole of the world|
|Detected circuit board||After SMT reflow oven, after DIP wave soldering, color ring resistance, after dispensing, component surface inspection|
|Detection method||TOC algorithm, Histogram algorithm, Match algorithm, Short algorithm, OTHER algorithm, CREST algorithm, PIN algorithm and many other leading international algorithms, the system automatically sets its parameters according to different detection points|
|camera||Full-color high-speed smart digital camera|
|Resolution / Vision Range / Speed||Standard: 25μm/Pixel FOV 51mm×51mm Detection speed <200ms/FOV|
|Optional: 20μm/Pixel FOV: 40mm×40mm Detection speed <180ms/FOV|
|Optional: 15μm/Pixel FOV: 30mm×30mm Detection speed <160ms/FOV|
|light source||Bright RRGB coaxial ring tower LED light source (color light)|
|Programming mode||Manually written, automatic frame, CAD data import automatically corresponding component library|
|remote control||Remote operation via TCP / IP network, view, start or stop machine operation, modify program, etc.|
|Detection coverage type||Offset, Tin, Short Circuit, Contamination, Missing, Skew, Tombstone, Side-up, Turnover, Misplaced, Damaged, Elevated, Polarity, Welded, Empty, Overfilled, Tin, Pinout Outgoing|
|Special features||Multiple programs running at the same time, support for automatic program retrieval; 0-359° rotating parts can be checked (unit is 1°)|
|Minimal part testing||15μm: 01005chip & 0.3pitch IC|
|SPC and process control||Full record of test data and statistics and analysis, any region can view production status and quality analysis, can output Excel, Txt and other file formats|
|Bar code system||Camera automatically recognizes and transmits Barcode (1D or 2D code), and MultiMark function (including Bad Mark)|
|Server mode||Central server can be used to centralize the management of several AOI data|
|operating system||Windows 7 Professional|
|Inspection result output||22-inch LCD monitor|
|PCB size range||50×50mm(Min)～430×330mm(Max)|
|PCB thickness range||0.3 to 5 mm|
|PCB clamping system edge clearance||TOP:3.5 mm Bottom:3.5 mm|
|The maximum PCB weight||3KG|
|PCB curvature||<5mm or 2% of the PCB diagonal length|
|Clear height above and below PCB||Top Side: 40 mm Option with 50 and 60 mm PCB Bottom Side: 100 mm|
|Conveyor system||Automatically opened and retracted bilateral fixtures, automatic compensation PCB bending deformation|
|Conveyor height above ground||880 to 930 mm|
|Conveyor Flow / Time||PCB moves in Y direction Feeding/Putting out time: 2 seconds|
|X/Y platform driver||Screw and AC servo motor drive; PCB fixed, Camera moves in the X direction, each with CTQ certification|
|power supply||AC230V 50/60 Hz less than 0.8KVA|
|equipment weight||About 520KG|
|Equipment dimensions||900×1070×1490mm (L×W×H)|
|Environmental temperature and humidity||10 to 35°C 35 to 80% RH (without condensation)|
|Equipment safety regulations||Comply with CE safety standards|
In the early days of PCB production, the inspection was mainly performed by manual inspection and electrical inspection. With the development of electronic technology, the PCB wiring density has been continuously improved, the difficulty of manual inspection has increased, and the misjudgment rate has increased. The health damage is greater, the preparation of the electrical test program is more cumbersome, the cost is higher, and certain types of defects cannot be detected. Therefore, the AOI automatic optical detector is increasingly used in PCB manufacturing.
PCB defects can be broadly classified as short circuits (including short-circuits in copper, shorts in thin lines, open circuits in electroplating, short circuit in dust, short-circuit in pits, repetitive short-circuit, short-circuit in stains, short circuit in dry film, short-circuit in over-etch, short-circuit in over-layer, and scratch Short circuit, wrinkle short circuit, etc.), open circuit (including repetitive open circuit, scratch open circuit, vacuum open circuit, open gap, etc.) and other defects that may lead to PCB scrap (including over-etching, electroplating, coke, and pinhole) in PCB production In the process, there may be some defects in the production of the substrate and the copper plating, but the main defects are generated after the etching. The AOI is generally detected after the etching process, and is mainly used to find the missing portion and the excess portion thereof.
In PCB inspection, there are many image comparison algorithms, and 2D detection is the main method. It mainly includes data processing (preliminary processing of input data, filtering of small pinholes, residual copper, and holes that do not need to be detected). The measurement class (characteristic extraction of input data, feature code, size, and location of record, and comparison with standard data) and topology (used to detect increased or missing features), Figure 1 is a schematic diagram of feature extraction method, ( a) is the binary map of the standard plate and the inspected plate, and (b) is the feature map after the mathematical morphology analysis.
AOI can generally find most of the defects, and there is a small amount of missed detection problems. However, the main problem that affects its reliability is misdetection. Dust, contamination, and poor reflectivity of some materials during PCB processing can cause false alarms. Therefore, after AOI is used to detect defects, manual verification must be performed.