OFFline Smt Aoi Machines , Automated Optical Inspection Machine 1 Year Warranty

Aleader ALD625 SMT offline AOI Machines Multiple MARK detection with Bad Mark function
 
Quick Detail
 

Modular hardware and software design, use more flexible and convenient.
Embedded multiple algorithms, high detection rate, low false positive rate.
Intelligent high-speed digital camera, detection speed meets the needs of two high-speed patch lines.
The hardware structure is compatible, and parameters are automatically set for different processes. One machine is used for multiple purposes.
Automated and manual programming capabilities of automatic frame and CAD data search component libraries.
Smart digital cameras automatically read Barcode, corresponding to each piece of data.
Multi-program and double-sided detection technology automatically switch the new MODE detection program.
Multiple MARK detection with Bad Mark function.
SPC and AOI combined, timely feedback information and technology are poor.
Multi-field detection design, with a variety of applications such as after the peak, red plastic sheet, color ring resistance, component surface detection.

Feature

 
 
Application

PCB inspection
In the early days of PCB production, the inspection was mainly performed by manual inspection and electrical inspection. With the development of electronic technology, the PCB wiring density has been continuously improved, the difficulty of manual inspection has increased, and the misjudgment rate has increased. The health damage is greater, the preparation of the electrical test program is more cumbersome, the cost is higher, and certain types of defects cannot be detected. Therefore, the AOI automatic optical detector is increasingly used in PCB manufacturing.
PCB defects can be broadly classified as short circuits (including short-circuits in copper, shorts in thin lines, open circuits in electroplating, short circuit in dust, short-circuit in pits, repetitive short-circuit, short-circuit in stains, short circuit in dry film, short-circuit in over-etch, short-circuit in over-layer, and scratch Short circuit, wrinkle short circuit, etc.), open circuit (including repetitive open circuit, scratch open circuit, vacuum open circuit, open gap, etc.) and other defects that may lead to PCB scrap (including over-etching, electroplating, coke, and pinhole) in PCB production In the process, there may be some defects in the production of the substrate and the copper plating, but the main defects are generated after the etching. The AOI is generally detected after the etching process, and is mainly used to find the missing portion and the excess portion thereof.
In PCB inspection, there are many image comparison algorithms, and 2D detection is the main method. It mainly includes data processing (preliminary processing of input data, filtering of small pinholes, residual copper, and holes that do not need to be detected). The measurement class (characteristic extraction of input data, feature code, size, and location of record, and comparison with standard data) and topology (used to detect increased or missing features), Figure 1 is a schematic diagram of feature extraction method, ( a) is the binary map of the standard plate and the inspected plate, and (b) is the feature map after the mathematical morphology analysis.
AOI can generally find most of the defects, and there is a small amount of missed detection problems. However, the main problem that affects its reliability is misdetection. Dust, contamination, and poor reflectivity of some materials during PCB processing can cause false alarms. Therefore, after AOI is used to detect defects, manual verification must be performed.