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|Place of Origin:||china|
|Minimum Order Quantity:||1|
|Delivery Time:||5-7 work days|
|Payment Terms:||T/T, Western Union|
|Weight::||2000KG||Lead Time::||IN Stork|
|Packing::||WOODENBOX||POWER:||3-phase 5-wire 380V|
|PCB WIDTH:||50-350MM||PAYMENT TERM:||T/T, Paypal, Westernunion Are All Allowed|
table top reflow oven,
lead free reflow ove
Curing Furnace SMT Soldering Furnace Luxurious lead-free eight-zone reflow reflow soldering white surface high quality
|· Computer hard disk reply||· Respond to multiple languages (Japanese, English, Chinese)|
|· Oxygen concentration meter||· Flux recovery machine|
|· Activated carbon regeneration unit||· Board stagnation alarm|
|· Temperature curve||· Separately control fan frequency converter|
|Target substrate||MAX. W250×L330 (mm)|
|MIN. W50×L50 (mm)|
|Component height||Upper 10,15,20,25,30mm|
|N2 gas supply||99.99% or more 0.4-0.7Mpa 300NL/min or more|
|Substrate conveying height (rolling line)||900±20mm|
|Input power||AC200V-50/60Hz-3φ 40kVA 116A|
|Equipment dimensions||W1310×L5300※1×H1274※2 (mm)|
|Total Weight||About 2100kg|
Curing Furnace SMT Soldering Furnace Luxurious lead-free eight-zone reflow RS reflow soldering
|Product Name:||SMT Reflow oven|
|Used for:||SMT FULL LINE|
|Our Main Market||Whole of the world|
Hot Plate Conduction Reflow: This type of reflow oven relies on a heat source under the conveyor belt or push plate to heat the components on the substrate by means of heat conduction. It is used for single side assembly of ceramic (Al2O3) substrate thick film circuits on ceramic substrates. Only by putting it on a conveyor belt can we get enough heat. Its structure is simple and it is cheap. Some of China's thick-film circuit factories introduced such equipment in the early 1980s.
Infrared (IR) reflow oven: This kind of reflow oven is mostly conveyor belt type. However, the conveyor belt only serves as a support and transmission base plate. The heating method is mainly based on the infrared heat source and is heated by radiation. The temperature inside the furnace is higher than the previous one. The method is uniform and the mesh is relatively large, and is suitable for reflow soldering heating of a double-sided assembled substrate. This kind of reflow oven can be said to be the basic type of reflow oven. Many are used in China and prices are relatively cheap.
Vapor phase reflow soldering: Vapor phase soldering (VPS), also known as condensing soldering. Heating fluorocarbon (early FC-70 fluorochlorinated solvent), melting point about 215°C, boiling to produce saturated vapor, condensing tube above and above the furnace, confining vapor in the furnace, encountering low temperature to be welded The PCB assembly emits latent heat of vaporization to melt the solder paste and solder the components and pads. The United States originally used it for the welding of thick-film integrated circuits (ICs). The latent heat release from air cylinders is insensitive to the physical structure and geometry of the SMAs, allowing the components to be evenly heated to the welding temperature, keeping the welding temperature constant, and eliminating the need for temperature control. In order to meet the requirements of different temperature welding, VPS has saturated vapor in the gas phase, low oxygen content, high thermal conversion rate, but high solvent cost, and is a typical ozone layer depleting substance, so its application is greatly limited, and the international community is nowadays Basically no longer use this method of loss of the environment.
Hot air reflow soldering: The hot air reflow oven transfers heat energy through the laminar flow of hot air. The heater and the fan are used to continuously increase the temperature of the air in the furnace and circulate. The weldment is heated by the hot gas in the furnace to achieve welding. The hot-air type reflow soldering furnace has the characteristics of uniform heating and stable temperature. The temperature difference between the upper and lower sides of the PCB and the temperature gradient along the length of the furnace is not easy to control and is generally not used alone. Since the 1990s, with the continuous expansion of SMT applications and the further miniaturization of components, device developers have improved the distribution of heaters, the circulation of air, and increased the temperature zone to 8, 10, so that The ability to further accurately control the temperature distribution of various parts of the furnace, more convenient for the ideal adjustment of the temperature curve. The hot air forced convection reflow oven has been continuously improved and improved, becoming the mainstream equipment for SMT welding.
Infrared + hot air reflow soldering: In the mid-1990s, reflow in Japan had a tendency to shift to infrared + hot air heating. It is heated by 30% infrared and 70% hot air as a heat carrier. The infrared hot air reflow oven effectively combines the advantages of infrared reflow soldering and forced convection hot air reflow soldering, and is an ideal heating method in the 21st century. It makes full use of the strong infrared radiation penetration characteristics, high thermal efficiency, saving electricity, while effectively overcoming the temperature difference and shielding effect of infrared reflow soldering, make up for the effect of hot air reflow soldering on the gas flow rate is too fast.
This kind of reflow oven is based on the IR furnace and adds hot air to make the temperature in the furnace more uniform. The heat absorbed by different materials and colors is different, that is, the Q value is different, and the resulting temperature rise AT is also different. For example, SMD's SMD package is black phenolic or epoxy, while the lead is a white metal, simply heating, the lead temperature is lower than its black SMD body. Together with the hot air, the temperature can be made more uniform, and the difference in heat absorption and shadowing can be overcome. Infrared + hot air reflow ovens have been used internationally.
Since infrared rays have bad effects on shading and color difference in parts with different heights, it is also possible to inject hot air to harmonize color aberrations and assist in the inadequacies at the dead ends. Hot nitrogen is most desirable for blowing hot air. The speed of convective heat transfer depends on the wind speed, but excessive wind speed will cause the components to shift and contribute to the oxidation of solder joints. The wind speed control is preferably 1.Om/s~1.8III/S. There are two forms of hot air production: axial fan production (easily forming laminar flow, which causes unclear temperature distinctions) and tangential fan production (fans are installed outside the heater, generating panel eddy currents so that each temperature zone can be Precise control).
Hot wire reflow: Hot wire reflow is a welding technique that uses a heated metal or ceramic to directly contact the weldment. It is usually used in the technology of connecting a flexible substrate with a rigid substrate. This heating method is generally not using solder paste. Tin-plated or anisotropic conductive adhesives, and special nozzles are required, so the welding speed is slow and the production efficiency is relatively low.
Hot gas reflow: hot gas reflow refers to the method of welding with hot air flow in a special heating head through air or nitrogen. This method requires different sizes of nozzles to be processed for different sizes of solder joints. The speed is relatively slow, and it is used for rework or repair. In development.
Laser Reflow, Beam Reflow: Laser Reflow is the use of a laser beam with good directionality and high power density. The laser system focuses the laser beam in a very small area and heats it in a very short time. A localized heating zone is formed. Commonly used lasers are C02 and YAG, which is a schematic diagram of the working principle of laser heating reflow.
The laser heating reflow soldering is highly localized, does not generate thermal stress, has small thermal shock, and is not susceptible to thermal damage. However, equipment investment is large and maintenance costs are high.
Induction reflow: Induction reflow equipment uses a transformer in the heating head and uses an inductive eddy current principle to weld the weldment. This welding method does not have mechanical contact and the heating speed is fast; the disadvantages are location-sensitive, temperature control is not easy, there is overheating Dangerous, electrostatic sensitive devices should not be used.
Infrared reflow soldering: Focused infrared reflow soldering is suitable for rework stations, for rework or partial soldering.
Fold classification by shape
Desktop reflow oven: The desktop equipment is suitable for small and medium-sized PCB assembly production with stable performance and economical price (approximately between RMB 40,000-80,000). Domestic private companies and some state-owned companies use more.
Vertical reflow oven: There are many types of vertical equipment, which is suitable for PCB assembly production of various users. The equipment has high-middle and low-end products, and the performance is also much different. The prices are also different (about 8-80 million RMB). Domestic institutes, foreign companies, and well-known companies use more.
Folding according to temperature zone classification
The length of the reflow oven's temperature zone is generally 45cm~50cm. The number of temperature zones can have 3, 4, 5, 6, 7, 8, 9, 10, 12, 15 or more temperature zones. From the welding point of view, reflow soldering There are at least three temperature zones, ie preheat zone, welding zone and cooling zone. Many furnaces usually exclude the cooling zone when calculating the temperature zone, ie only the temperature rising zone, the heat preservation zone and the welding zone are calculated.