SMT BGA Rework Station CN012 MODEL FULL-AUTO QUICK mobile phone bga rework station
1. This machine adopts a linear slide so that the three axes of X, Y and Z can all be fine-tuned or quickly positioned, with high positioning accuracy and quick operability.
2, the machine uses high-precision temperature control instrument, built-in PC serial port, external temperature measurement interface, with software, can achieve computer control.
3, the use of three temperature zone independent heating, upper and lower main temperature heating zone, the bottom temperature zone infrared heating, the temperature is accurately controlled at ± 2 degrees, the upper temperature zone can be freely moved according to the need, the upper and lower heaters can also set up multiple temperature control. IR preheat zone can adjust output power according to actual requirements.
4, equipped with a variety of specifications alloy BGA nozzle, the wind nozzle can rotate 360 degrees, easy to install and replace, different applications can be customized according to customer requirements.
5, use high-precision K type
1. The linear slides can be used to fine-tune or fast-position the X, Y, and Z axes with high positioning accuracy and quick operation.
2. The machine adopts high-definition touch screen man-machine interface, PLC control, can store multiple groups of user temperature curve data, working temperature to curve data to the touch screen display, with instant curve analysis function, work time class meter function, Real-time display temperature conditions in each temperature range.
3, using three separate heating zones, the upper and lower temperature zone hot air heating, infrared heating at the bottom temperature zone, the temperature is accurately controlled at ± 3 degrees, the upper temperature zone can be freely moved according to needs, the upper and lower heating device can also set up multiple temperature control. IR Preheat zone can adjust output power according to actual requirements.
4, hot air nozzle can rotate 360 °.
|Total power||Total Power||5200W|
|Upper heating power||Top heater||1200W|
|Lower heating power||Bottom heater||The second temperature zone 1200W|
|power supply||power||AC220V±10% 50/60Hz|
|Targeting||Positioning||V-shaped card slot, special fixture|
|Temperature control method||Temperature control||K-type thermocouple (K Sensor) Closed loop|
|Temperature control accuracy||Temp accuracy||±1 degree|
|PCB size||PCB size||Various mobile motherboards|
|Applicable chip||BGA chip||2X2-30X30mm|
|Suitable for minimum chip spacing||Minimum chip spacing||0.02mm|
|External temperature measurement port||External Temperature Sensor||One, expandable (optional)|
|Machine weight||Net weight||35kg|