5 / 8 Heating Zones SMT Reflow Oven Soldering 380V For Led PCB Board

3 4 5 6 8 10 12 heating zones smt reflow oven led PCBboard reflow soldering machine 1year warranty

Feature

 
 
Application 

Process development trend

In recent years, with the development of many electronic products in the direction of small size, light weight, and high density, especially the large-scale use of handheld devices, the original SMT technology poses severe challenges in the material technology of components and components, and as a result SM has been obtained. The opportunity for rapid development. lC pin pitch development to 0.5mm, 0.4mm, 0.3mm, BGA has been widely adopted, CSP also emerged, and showed a rapid upward trend, materials, no-clean, low-residual solder paste has been widely used. All of these have brought new requirements for reflow soldering processes. One general trend is to require more advanced heat transfer methods for reflow soldering to achieve energy conservation and uniform temperature, which suits the soldering requirements of dual-board PCBs and new device packaging methods. Gradually realize the full replacement of wave soldering. In general, reflow ovens are moving in the direction of high efficiency, versatility and intelligence. The main development paths are as follows. In these development fields, reflow soldering leads the future direction of electronic products.

Fold nitrogen

The use of inert gas protection in reflow solder has been around for a while and has been used in a wide range of applications. Due to price considerations, nitrogen protection is generally chosen. Nitrogen reflow has the following advantages.

(1) Prevent reduction of oxidation.

(2) Improve welding wetting power and speed up wetting.

(3) Reduce solder ball generation, avoid bridging, and obtain good soldering quality.

Folded double back

Double-sided PCBs have become quite popular and gradually becoming more complex. The reason why it is so popular is that it provides designers with a very good flexibility to design smaller, compact, low-cost products. Both panels are generally soldered to the top (component surface) by reflow soldering and then soldered below (pin face) by wave soldering. There is a trend toward double-sided reflow, but there are still some problems with this process. The bottom element of the large plate may fall during the second reflow process, or the bottom part of the solder joint may melt to cause solder joint reliability problems.

Through-hole insertion components

Through-hole reflow soldering, sometimes referred to as classified component reflow soldering, is gradually emerging. It can remove the wave soldering process and become a process link in PCB hybrid technology. One of the greatest benefits of this technology is its ability to be used as a surface. The use of through-hole inserts to achieve good mechanical connection strengths while adhering to the advantages of mounting manufacturing processes. The flatness of large-size PCB boards cannot enable the pins of all surface-mount components to contact the pads. Even if the pin and the pad can be contacted, the mechanical strength it provides is often not enough, it is easy to break off in the use of the product and become a point of failure.