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Durable CNSMT Smt Solder Paste Warm Up Machine Paste Temperature Back Up Device

Durable CNSMT Smt Solder Paste Warm Up Machine Paste Temperature Back Up Device

  • High Light

    conformal coating equipment

    ,

    bga rework machine

  • Product Name
    Smt Solder Paste Warm Up Machine
  • Dimensions
    L500*W300*H230(mm)
  • Voltage
    110V/220V
  • Weight
    15KG
  • Lead Time
    1-2days
  • Application
    Smt Reflow Parts
  • Place of Origin
    China
  • Brand Name
    CNSMT
  • Certification
    CE
  • Model Number
    smt solder paste warm up machine
  • Minimum Order Quantity
    1
  • Price
    negotiation
  • Packaging Details
    Woodenbox
  • Delivery Time
    1-2 work days
  • Payment Terms
    T/T, Western Union,paypal
  • Supply Ability
    10pcs/day

Durable CNSMT Smt Solder Paste Warm Up Machine Paste Temperature Back Up Device

CNSMT smt solder paste warm up machine Paste temperature back-up machine

CNSMT smt solder paste warm up machine Paste temperature back-up machine

 

 

First, product performance and characteristics:
1. It is assembled and produced by imported electrical components.
2. Each tank of solder paste placement tank has independent time control. Manually put the refilled solder paste or red glue into the reheating machine slot, the indicator light is green, and the solder paste or red plastic bottle will sink automatically after setting the time. After the set temperature recovery time is reached, the process is completed. The temperature will pop up automatically, the red alarm will flash and there will be an audible alarm.
3. This type of warming machine can return 4 cans of solder paste at the same time. Each jar of 500g solder paste needs to be added according to customer requirements. Please contact our online customer service.
4. In the case of sudden power failure of this machine, if the set time is not reached, the solder paste bottle will pop up automatically. (Note: If the solder paste bottle does not pop up after the power is cut off, continue to return to the temperature, you can contact the sales staff to add additional devices.)
Second, the use and requirements of solder paste:
When the solder paste is removed from the refrigerator before using the solder paste, the temperature is much lower than the room temperature. If the cap is opened without returning to the temperature, it is easy to condense the moisture in the air and adhere to the solder paste. After printing with this solder paste, in the case of over-reflow oven (temperature exceeds 200 ° C), the water is rapidly vaporized due to strong heat, causing "explosive tin" phenomenon, which leads to tin beads and even damage to components. In order to match the welding process in production, such as printing performance, collapse resistance, release properties, etc., the solder paste needs to be warmed before use.
At present, most factories use the manual method to manage the temperature of the solder paste: the solder paste to be used is placed on the table at the front end of the printing machine, and the operator manually records the return time. This method is not only inefficient, it wastes a lot of production time, and it is often the case that the operator uses a solder paste that is not completely warmed due to the pursuit of production. Or because of different operators, the same product, sometimes using different rewarming time solder paste, produces different welding effects.
Some operators also took out the solder paste from the refrigerator and immediately stirred it. After the stirring, the temperature was also raised, and then it was used on the line. This did not seem to have any effect after reflow soldering. It may sometimes be no problem to use a solder paste that has no rewarming and direct agitation, but there is a difference between the natural and post-warming and non-returned solder paste. Direct agitation can play a certain role in temperature recovery, but it is never complete. Maybe the naked eye looks like the effect of reflow is not the same, but in x-ray you can find that there will be a lot of bubbles, or under the 3d microscope, naturally return to the temperature and stir the temperature of the solder paste, you can also See a lot of difference.
 
Third, the advantages of using solder paste back to the temperature machine:
After the mixer has been stirred, the viscosity will change and it will feel no change when printed, so many people think that there is no problem. However, the temperature recovery is the optimum temperature for the activity of the flux. There is a difference between the two. Of course, the agitation will have a certain temperature increase, but it does not reach the required temperature. Also, when you carefully observe the bubbles of the chip and bga, you will find that the void rate is different.
1. The use of the temperature recovery machine can better solve the problem of natural temperature recovery, and can effectively assist in controlling the production plan and improving production efficiency.
2. Only the various processes in the production process are strictly controlled to ensure the stability of product quality.




Business Scope:
1.Buy and sells SMT pick and place machines(YAMAHA JUKI FUJI,SAMSUNG,PANASONIC,,SIEMENS,ASSEMBLON,Mirae, SONY,...
2.SMT Full-auto printer&semi-auto printer
3.SMT reflow oven& wave solder machine
4.SMT loader and unloader
5.SMT conveyor
6.AOI, SPI
7.SMT peripheral equipment.
8.Insert machine
9.Machine spare parts such as feeders nozzles
10.Full line solution service
Contact:


CNSMT Electronics Equipment Co,.LTD
Ms:Lizzy wong
Email:Lizzy@smtlinemachine.com
info@smtlinemachine.com
www.smtlinemachine.com
Mb/whatsapp/wechat:+8615915451009
SKYPE:smtdwx