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PCB placement pad:
1 . Place pad method
You can execute the Place/Pad command in the main menu, or use the Place Pad button in the component placement toolbar.
After entering the Pad state, the mouse will change to a cross shape, and the mouse will be moved to a suitable position to complete the placement of the pad.
2 . Pad property settings
The properties of the pad are set in the following two ways:
● When you place the pad with the mouse, the mouse will change to a cross shape. Pressing the Tab key will bring up the Pad (pad properties) settings dialog box.
7-24 Pad Property Settings Dialog Box
● Double-clicking directly on a pad that has been placed on the PCB board can also bring up the pad property setting dialog box. There are the following settings in the pad properties settings dialog box:
● Hole Size: used to set the inner diameter of the pad.
● Rotation : The rotation angle set with a set pad.
● Location : It is used to set the position of the x and y coordinates of the pad center.
● Designator text box: used to set the pad number.
● Layer drop-down list: From this drop-down list, you can select the wiring layer where the pads are placed.
● Net drop-down list: This drop-down list is used to set the pad's network.
● Electrical Type drop-down list: Used to select the electrical characteristics of the pad. There are 3 choices for this drop-down list: Load, Source, and Terminator.
● Testpoint: It is used to set whether the pad is used as a test point. Only the top and bottom pads can be used as test points.
● Locked option: Select this option to indicate that the position will be fixed after the pad is placed.
● Size and Shape option area: used to set the size and shape of the pad
● X-Size and Y-Size: Set the size of the pad's x and y, respectively.
● Shape drop-down list: used to set the shape of the pad, Round (round), Octagonal (octagon) and Rectangle
● Paste Mask Expansions option area: Used to set the properties of the solder mask.
● Solder Mask Expansions area: Used to set solder mask properties.  abc
Various types of membrane
These films are not only indispensable in the production process of PcB, but also a necessary condition for component soldering. According to the location and function of the "membrane", the "membrane" can be divided into component surface (or solder surface) flux film (TOp or Bottom and component surface or solder surface) solder mask (TOp or BottomPaste Mask) As the name implies, the flux film is a layer of film that is applied on the pad to improve the solderability, that is, on the green board, each light-colored round spot is slightly larger than the pad. The case of the solder mask is just the opposite. To adapt the fabricated board to wave soldering and other forms of soldering, it is required that the copper foil on the non-pads of the board cannot be soldered. Therefore, a layer of paint must be applied to all parts other than the solder pads to prevent the tin from being applied to these parts. It can be seen that the two membranes are a complementary relationship. From this discussion, it is not difficult to determine the menu
Similar to the "solder Mask En1argement" and other settings.
There are two meanings
In the case of automatic cabling, a network connection similar to a rubber band is used for observation. After the components are transferred to the network table and a preliminary layout is performed, the “Show” command can be used to see the cross-over status of the network connection under the layout and adjust it continuously. The position of the components minimizes this crossover to obtain the maximum routing rate for automatic wiring.This step is very important, it can be said that the sharpening knife does not mistakenly cut the wood work, spend more time, value!In addition, the end of the automatic wiring, also Which networks have not been deployed yet can also be searched through this function. After finding out the network, manual compensation can be used. If it cannot be compensated, the second meaning of “flying line” should be used, that is, the future printing plate. The wires are connected to these networks.To confess that if the circuit board is produced in high-volume automatic lines, this flying line can be regarded as a zero-European resistance value, with a uniform pad pitch resistor element to design.
Printed circuit boards (PCBs) appear in almost every type of electronic device. If there are electronic parts in a certain device, they are also mounted on PCBs of different sizes. In addition to fixing a variety of small parts, the main function of the PCB is to provide the electrical connection between the upper parts. With more and more complex electronic devices, more and more parts are needed, and the lines and parts on the PCB are becoming more and more intensive. The standard PCB looks like this. Bare boards (without parts on top) are also often referred to as "Printed Wiring Boards (PWBs)."
The substrate of the board itself is made of a material that is insulated and insulated and hard to bend. The fine line material that can be seen on the surface is copper foil. The original copper foil is covered on the entire board and is partially etched away during the manufacturing process. The remaining part becomes a mesh-like fine line. These lines are called conductor patterns or wires and are used to provide circuit connections to parts on the PCB.
To fix the parts on the PCB, we soldered their pins directly to the wiring. In the most basic PCB (single panel), parts are concentrated on one side, and wires are on the other side. As a result, we need to make a hole in the board so that the pin can pass through the board to the other side, so the pin of the part is soldered on the other side. Because of this, the front and back of the PCB are called Component Side and Solder Side, respectively.
If there are some parts on the top of the PCB that need to be removed or replaced after the production is complete, the part will be installed with a socket. Since the socket is directly welded to the board, parts can be detached arbitrarily. Seen below is the ZIF (Zero Insertion Force) socket, which allows the part (in this case, the CPU) to be easily plugged into the socket and removed. The lever next to the socket can be fixed after you insert the part.
If we want to connect two PCBs to each other, we generally use an edge connector commonly known as the "gold finger." The gold finger contains many exposed copper pads, which are in fact part of the PCB layout. Usually when connecting, we insert the golden finger on one of the PCBs into the appropriate slot on the other PCB (commonly called the expansion slot Slot). In a computer, such as a display card, sound card, or other similar interface card, all of them are connected to the motherboard through a golden finger.
The green or brown color on the PCB is the color of the solder mask. This layer is an insulating protective layer that protects the copper wire and prevents parts from being soldered to the wrong place. A layer of silk screen is printed on the solder mask. Usually the text and symbols (mostly white) are printed on it to indicate the position of each part on the board. The screen printing surface is also called a legend.
The Chinese name of the PCB is the printed circuit board, also known as the printed circuit board, and the printed circuit board is the important electronic component that supports the electronic components and is the provider of electrical connections for electronic components. Because it is made using electronic printing technology, it is called "printing" circuit board.
PCB proofing refers to the process of trial production of printed circuit boards prior to mass production. The main application for electronic engineers is designing a good circuit, and the process of conducting small-scale trial production to the factory after PCB Layout is completed is the PCB proofing. The production quantity of PCB proofing generally has no specific boundary. Generally, engineers call it PCB proofing before the product design has not been confirmed and completed the test .
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